Series

PCBs made in Italy at our Fano plant.

Our preferred approach is to manufacture on the basis of CRM scheduling, we offer highly standardised quality and we adhere rigorously to agreed delivery times.

 

 

REQUIREMENTS CHARACTERISTICS
Number of layers 1, 2, 4, 6, 8, 10
Base material

- FR4 Tg =135 °C - Td = 315 °C - DK = 4.37 –  DF = 0.022 – CTI = cl2 –  Thermal Conductivity 0.36 W/mk - ASTM E1952; - FR4 Tg = 150 °C - Td 330 °C – DK = 3.90 –  DF = 0.022 - T260 >60 minutes –  T 288 °C > 10 minutes - CTI cl3   Thermal Conductivity 0.36 W/mk - ASTM E1952; - FR4 Tg = 180 °C - Td = 340 °C - Dk = 4.04 –  DF = 0.021 - T260 = 60 minutes –  T 288 °C = 30 minutes - CTI cl3.

Thickness of base material 0.1 - 3.2 mm
Base copper (copper foil) outer layer 17μm / ½oz -105 μm / 3oz
Base copper (copper foil) inner layer 17μm / ½oz -105 μm / 3oz
Construction of multi-layer laminates Standard
Maximum PCB dimensions 640 mm x 560 mm
Min. track width/min. insulation 0.100 mm
Min. finished hole size 0.200 mm
Minimum annular ring on outer layer with metallized or non-metallized hole 0.125 mm - PTH –  0.125 mm - NPTH
Minimum annular ring on inner layer with metallized or non-metallized hole 0.150 mm - PTH –  0.150 mm - NPTH
Minimum clearance between outermost track and edge of outer layer 0.100 mm (routed)
Minimum clearance between outermost track and edge of inner layer 0.200 mm (routed)
Surface finish Chemical silver, HAL, LF HAL, chemical gold Electrolytic gold
Soldermask Green, red, blue, black, yellow, transparent, white and high-reflectance white for LEDs
Silkscreen symbol colour Green, red, blue, black, yellow, white
Minimum clearance between individual circuits shaped with a milling machine and/or arranged in a panel > 2.0 mm (CNC shaping)
Minimum clearance between the outermost tracks for cutting circuit panel by means of V-cut scoring > 0.4 mm with V-cut scoring
Electrical testing Standard for all PCBs
UL marking Available to order

 

CONFIGURE A SERIES with CSM