PCBs made in Italy at our Fano plant.
Our preferred approach is to manufacture on the basis of CRM scheduling, we offer highly standardised quality and we adhere rigorously to agreed delivery times.
|Number of layers||1, 2, 4, 6, 8, 10|
- FR4 Tg =135 °C - Td = 315 °C - DK = 4.37 – DF = 0.022 – CTI = cl2 – Thermal Conductivity 0.36 W/mk - ASTM E1952; - FR4 Tg = 150 °C - Td 330 °C – DK = 3.90 – DF = 0.022 - T260 >60 minutes – T 288 °C > 10 minutes - CTI cl3 Thermal Conductivity 0.36 W/mk - ASTM E1952; - FR4 Tg = 180 °C - Td = 340 °C - Dk = 4.04 – DF = 0.021 - T260 = 60 minutes – T 288 °C = 30 minutes - CTI cl3.
|Thickness of base material||0.1 - 3.2 mm|
|Base copper (copper foil) outer layer||17μm / ½oz -105 μm / 3oz|
|Base copper (copper foil) inner layer||17μm / ½oz -105 μm / 3oz|
|Construction of multi-layer laminates||Standard|
|Maximum PCB dimensions||640 mm x 560 mm|
|Min. track width/min. insulation||0.100 mm|
|Min. finished hole size||0.200 mm|
|Minimum annular ring on outer layer with metallized or non-metallized hole||0.125 mm - PTH – 0.125 mm - NPTH|
|Minimum annular ring on inner layer with metallized or non-metallized hole||0.150 mm - PTH – 0.150 mm - NPTH|
|Minimum clearance between outermost track and edge of outer layer||0.100 mm (routed)|
|Minimum clearance between outermost track and edge of inner layer||0.200 mm (routed)|
|Surface finish||Chemical silver, HAL, LF HAL, chemical gold Electrolytic gold|
|Soldermask||Green, red, blue, black, yellow, transparent, white and high-reflectance white for LEDs|
|Silkscreen symbol colour||Green, red, blue, black, yellow, white|
|Minimum clearance between individual circuits shaped with a milling machine and/or arranged in a panel||> 2.0 mm (CNC shaping)|
|Minimum clearance between the outermost tracks for cutting circuit panel by means of V-cut scoring||> 0.4 mm with V-cut scoring|
|Electrical testing||Standard for all PCBs|
|UL marking||Available to order|
CONFIGURE A SERIES with CSM