Metal core PCBs are used when the application requires good dimensional stability, mechanical stress resistance and high heat dissipation capacity.
These characteristics make them ideal for use with LED lighting and power circuits.
Various materials are available, with different thermal conductivity indices.
It is possible to use thermal CEM3, as a valid, economical alternative.
METAL CORE PCB REQUIREMENTS | CHARACTERISTICS |
Number of layers | 1 |
Base material |
Aluminium, thk 1.0-1.6mm |
Insulating thickness over aluminium | 0.100 mm ceramic |
Min. track width/spacing | 0.150 mm |
Insulation | 0.150 mm |
Hole diameter | 0.200 mm |
Base copper foil | 35μm / 1 ounce 70μm / 2 ounces |
Surface finish | Chemical Silver (AG) |
Solder mask | 0.100 mm (routed) |
Minimum clearance between outermost track and edge of inner layer | 0.200 mm (routed) |
Surface finish | Chemical Silver (AG); selective Ni/Au (ENIG) |
Solder mask | Green, red, blue, black, yellow, transparent, white and high-reflectance white for LEDs |
Minimum clearance between individual circuits shaped with a milling machine and/or arranged in a panel | > 2.0 mm (CNC shaping) |
Minimum clearance between individual circuits shaped with a milling machine and/or arranged in a panel | > 0.4 mm with V-cut scoring |
Minimum clearance between the outermost tracks for cutting circuit panel by means of V-cut scoring | > 0.4 mm with V-cut scoring |
Electrical testing | Standard for all PCBs |