Layer Stackup


Many copper foil are pressed together forming a multilayer pcb in wich prepreg and laminates are used as insulation material between each

layers of the printed circuit board (PCB). 

It is not always necessary to know the Stackup used but in certain contexts it is necessary to size appropriately the printed circuit tracks according to the 

insulating layer.


In this example we can see the copper thickness of each layer (35 micron) , prepreg and laminate thickness.

Dielectric constant is shown in the second image and is used to calculate the impedance . 

In the next pages there are our selected stackup , always available in our csm-circuiti online calculator .